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Lee H Tullidge

age ~64

from Urbana, OH

Also known as:
  • Lee Tullidge
  • Lee Harrison Tullidge
  • Janet Lee Tullidge
  • Harrison Tullidge
  • Tullidge Harrison Lee
141 State Route 296, Urbana, OH 43078937-6538604

Lee Tullidge Phones & Addresses

  • 141 State Route 296, Urbana, OH 43078 • 937-6538604
  • 41 State Route 296, Urbana, OH 43078
  • Elizabethtown, PA
  • 141 E State Route 296, Urbana, OH 43078 • 937-2669979

Work

  • Position:
    Professional/Technical

Education

  • Degree:
    High school graduate or higher

Us Patents

  • Method For Providing An Efficient Thermal Transfer Through A Printed Circuit Board

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  • US Patent:
    8112884, Feb 14, 2012
  • Filed:
    Oct 8, 2007
  • Appl. No.:
    11/868871
  • Inventors:
    Lee H. Tullidge - Urbana OH,
    Leonard De Oto - Springfield OH,
    Tim Larson - Minnetonka MN,
    Patrick O'Keefe - Minnetonka MN,
    Herb Gertz - Minnetonka MN,
  • Assignee:
    Honeywell International Inc. - Morristown NJ
  • International Classification:
    H01K 3/10
  • US Classification:
    29852, 29846, 174262, 205125
  • Abstract:
    A method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.
  • Hole In Pad Thermal Management

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  • US Patent:
    8575492, Nov 5, 2013
  • Filed:
    Feb 14, 2012
  • Appl. No.:
    13/396485
  • Inventors:
    Lee H. Tullidge - Urbana OH,
    Leonard De Oto - Springfield OH,
    Tim Larson - Minnetonka MN,
    Patrick O'Keefe - Minnetonka MN,
    Herb Gertz - Minnetonka MN,
  • Assignee:
    Honeywell International Inc. - Morristown NJ
  • International Classification:
    H05K 1/00
  • US Classification:
    174252, 174262, 174264
  • Abstract:
    A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.
  • Electronics Packaging Assembly With Parallel Circuit Boards And A Vibration Stiffener

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  • US Patent:
    20060171132, Aug 3, 2006
  • Filed:
    Jan 28, 2005
  • Appl. No.:
    11/043931
  • Inventors:
    Lee Tullidge - Urbana OH,
    William Tillinghast - Dayton OH,
  • International Classification:
    H05K 7/14
  • US Classification:
    361796000, 361801000
  • Abstract:
    An electronics packaging assembly () includes: an assembly housing (); a plurality of printed circuit boards () arranged in parallel within the assembly housing (); and a vibration stiffener (). The printed circuit boards () each have a notch () on one edge. The vibration stiffener () is arranged within the assembly housing () along a lateral direction relative to the plurality of printed circuit boards () and includes a plurality of slots () that engage with corresponding notches () of the plurality of printed circuit boards (), wherein engagement of the vibration stiffener () with the plurality of printed circuit boards () limits flexing of the printed circuit boards () in the lateral direction. In one implementation, a portion of the assembly housing () contacts and applies pressure to the vibration stiffener () to keep the vibration stiffener () in place.

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Lee Tullidge Urbana OH

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