Mark B Farrelly

US Patent:

6664511, Dec 16, 2003

Filed:

Oct 28, 2002

Appl. No.:

10/281876

Inventors:

Douglas E. Crafts - San Jose CA
James F. Farrell - San Jose CA
Mark B. Farrelly - San Jose CA
Suresh Ramalingam - Fremont CA
Kenzo Ishida - San Jose CA

Assignee:

JDS Uniphase Corporation - San Jose CA

International Classification:

H05B 100

US Classification:

219209, 219210, 219520, 219385

Abstract:

A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e. g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

US Patent:

6697553, Feb 24, 2004

Filed:

Feb 15, 2002

Appl. No.:

10/077581

Inventors:

Jyoti Kiron Bhardwaj - Cupertino CA
Robert James Brainard - Sunnyvale CA
David J. Chapman - San Jose CA
Douglas E. Crafts - San Jose CA
David Dougherty - Sunnyvale CA
Erik W. Egan - Oakland CA
James F. Farrell - San Jose CA
Mark B. Farrelly - San Jose CA
Niranjan Gopinathan - Santa Clara CA
Kenzo Ishida - Saratoga CA
David K. Nakamoto - Sunnyvale CA
Thomas Thuan Nguyen - San Jose CA
Suresh Ramalingam - Fremont CA
Steven M. Swain - San Jose CA
Sanjay M. Thekdi - Santa Clara CA
Anantharaman Vaidyanathan - San Jose CA
Hiroaki Yamada - San Jose CA
Yingchao Yan - Milpitas CA

Assignee:

JDS Uniphase Corporation - San Jose CA

International Classification:

G02B 634

US Classification:

385 37, 385 24, 385 46, 385 43

Abstract:

A planar lightwave circuit includes an arrayed waveguide grating (AWG), with input and output waveguides, partially curved array waveguides with respective length differences, and planar waveguide regions for focusing optical energy between the input/output and array waveguides. Optimal waveguide widths and spacing along the planar waveguide region facets are disclosed, which are largely determinative of AWG size and optical performance. Also disclosed are optimal cross-sectional waveguide dimensions (e. g. , width and height); modified index of refraction difference between the waveguide core and cladding regions; and optimal array waveguide lengths, path length differences, and free spectral range. These features, especially when combined with advanced fiber attachment, passivation and packaging techniques, result in high-yield, high-performance AWGs (both gaussian and flattop versions).

US Patent:

6874948, Apr 5, 2005

Filed:

Feb 14, 2002

Appl. No.:

10/077530

Inventors:

Mark Brian Farrelly - San Jose CA, US
Theodore David Bennett - Goleta CA, US

Assignee:

The Regents of the University of California - Oakland CA

International Classification:

G02B006/30
G02B006/26
G02B006/36

US Classification:

385 88, 385 49, 385 50, 385 51, 385 89, 385 90, 385 91, 385 92, 385 93, 385 95, 385 96, 385 97

Abstract:

A method and apparatus for bonding optical fibers are disclosed. A fiber bonding device feeds an optical fiber through a supportive sheath having a ceramic tip at its end. The optical fiber extends slightly beyond the ceramic tip and is aligned with the focal point of a laser, which causes the end of the optical fiber to melt, forming a molten region. The ceramic tip then extends partially into a substrate surface, causing the molten region of the optical fiber to become bonded to the substrate. The process is controlled by computer logic, such that it is an automated, precision process for bonding optical fibers.

US Patent:

6945708, Sep 20, 2005

Filed:

Feb 18, 2003

Appl. No.:

10/368195

Inventors:

Douglas E. Crafts - San Jose CA, US
James F. Farrell - San Jose CA, US
Mark B. Farrelly - San Jose CA, US
Duane Cook - San Jose CA, US
Satyanarayana Rao Peddada - San Jose CA, US

Assignee:

JDS Uniphase Corporation - San Jose CA

International Classification:

G02B006/12

US Classification:

385 89, 385 14, 385 88, 385 94

Abstract:

An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

US Patent:

7203390, Apr 10, 2007

Filed:

Aug 10, 2005

Appl. No.:

11/200696

Inventors:

Douglas E. Crafts - San Jose CA, US
James F. Farrell - San Jose CA, US
Mark B. Farrelly - San Jose CA, US
Duane Cook - San Jose CA, US
Satyanarayana Rao Peddada - San Jose CA, US

Assignee:

JDS Uniphase Corporation - Milpitas CA

International Classification:

G02B 6/12

US Classification:

385 14, 385 94, 385129

Abstract:

An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

US Patent:

8242350, Aug 14, 2012

Filed:

May 15, 2009

Appl. No.:

12/454321

Inventors:

Steven A. Cashion - San Diego CA, US
Michael R. Bowser - Los Angeles CA, US
Mark B. Farrelly - Carlsbad CA, US
Braden E. Hines - Pasadena CA, US
Howard C. Holmes - Boulder Creek CA, US
Richard J. Russell - La Crescenta CA, US
Michael F. Turk - Los Angeles CA, US

International Classification:

H01L 31/042
F24J 2/10

US Classification:

136246, 136251, 136259, 126600, 126684

Abstract:

The present invention relates to photovoltaic power systems, photovoltaic concentrator modules, and related methods. In particular, the present invention features concentrator modules having interior points of attachment for an articulating mechanism and/or an articulating mechanism that has a unique arrangement of chassis members so as to isolate bending, etc. from being transferred among the chassis members. The present invention also features adjustable solar panel mounting features and/or mounting features with two or more degrees of freedom. The present invention also features a mechanical fastener for secondary optics in a concentrator module.

US Patent:

20030006224, Jan 9, 2003

Filed:

Jul 9, 2001

Appl. No.:

09/901474

Inventors:

Douglas Crafts - San Jose CA, US
James Farrell - San Jose CA, US
Mark Farrelly - San Jose CA, US
Suresh Ramalingam - Fremont CA, US

Assignee:

Scion Photonics, Inc. - Milpitas CA

International Classification:

H05B003/00

US Classification:

219/209000, 219/385000, 219/520000

Abstract:

A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

US Patent:

20030219192, Nov 27, 2003

Filed:

May 7, 2003

Appl. No.:

10/429189

Inventors:

Douglas Crafts - San Jose CA, US
James Farrell - San Jose CA, US
Mark Farrelly - San Jose CA, US

Assignee:

JDS UNIPHASE CORPORATION - San Jose CA

International Classification:

G02B006/12

US Classification:

385/014000

Abstract:

Planar lightwave circuits (PLCs) are typically provided with a passivation coating layer to prevent damaging effects of environmental factors. In certain cases, deep trenching or a similar procedure after passivation removes the protective passivation coating, exposing the underlying layers. Without the passivation coating, the exposed core and cladding layers may absorb moisture resulting in an unacceptable shift in their refractive index. A supplemental hermetic sealing technique suitable for use in localized areas of a PLC, e.g., in areas where passivation may have been removed, consists of providing a sealing lid having a sealing surface, and diffusion-bonding the sealing surface of the sealing lid to the bonding surface about the PLC area. Preferably, prior to said diffusion bonding, the upper bonding surface about the PLC area and the sealing surface of the sealing lid are smoothed to facilitate the bonding.