Richard A Tyo

Location:

Phoenix, Arizona Area

Industry:

Information Technology and Services

Experience:

Intel Corporation (Public Company; INTC; Semiconductors industry): Sr. Systems Integrator,  (February 2009-Present) Senior Systems Integrator in the Embedded & Communication Division (ECD) performing systems engineering and integration of advanced research prototype embedded ...

Work:

Phoenix St. Luke's Behavioral Health Center
Phoenix, AZ
May 2014 to Jun 2014
Student Nurse Banner Good Samaritan Medical Center
Phoenix, AZ
Mar 2014 to May 2014
Student Nurse Affiliated Computer Services, a Xerox Company
Tempe, AZ
Oct 2012 to Jan 2014
Project Based Customer Care Representative BBVA Compass Bank
Gilbert, AZ
Jun 2011 to Jan 2012
Financial Sales Advisor II Wells Fargo Bank
Gilbert, AZ
Jun 2010 to Jun 2011
Teller Visionary Properties
Gilbert, AZ
May 2009 to Jun 2010
Property Manager Starbucks Coffee Corporation
Gilbert, AZ
Aug 2006 to May 2009
Shift Supervisor The Place at Gilbert, Assisted Living Facility
Gilbert, AZ
Aug 2005 to Aug 2006
Assistant Activities Director and Assistant Chef

Education:

Arizona State University - College of Nursing and Healthcare Innovation
Phoenix, AZ
2014 to 2014
Bachelor of Science in Nursing Arizona Medical Training Institute (AMTI)
Mesa, AZ
2012 to 2012
Certified Nursing Assistant License in License Number: CNA1000036334 Heart Savers, Inc. and Arizona Medical Training Institute (AMTI)
Mesa, AZ
2012 to 2012
BLS for Health Care Providers (CPR and AED) Arizona State University - W.P. Carey School of Business
Tempe, AZ
2007 to 2012
Bachelor of Science in Marketing

Skills:

Microsoft Word, Microsoft Excel, Microsoft PowerPoint, Written and Oral Communication, Analytical/Problem Solving, Customer Service

US Patent:

20060109120, May 25, 2006

Filed:

Nov 19, 2004

Appl. No.:

10/993758

Inventors:

Jeremy Burr - Portland OR,
Joshua Posamentier - Oakland CA,
Badari Kommandur - Hillsboro OR,
Lew Adams - Carmel CA,
Richard Tyo - Gilbert AZ,

International Classification:

G08B 13/14

US Classification:

340572100

Abstract:

A radio frequency identification (RFID) antenna and/or RFID tag circuit may be fabricated on a substrate. The substrate may be a wafer, a die created from a wafer, or an integrated circuit package substrate. The RFID tag may also be distributed between the die and the package substrate in an integrated circuit package. In some embodiments the RFID tag may be fabricated in the lower layers of the substrate and become operational before the rest of the circuitry on the substrate has been fabricated.